镀液流动对泡沫炭真空超声化学镀铜的影响

Effect of Plating Solution Flow Pattern on Preparation of Electroless Copper-Plated Carbon Foam under Vacuum and Ultrasonic Conditions

真空超声辅助化学镀铜,可以在大体积泡沫炭内部孔隙表面镀铜,但沉铜分布不均。在此基础上,本研究强制镀液在泡沫炭内部充分流动,并探究流动方式对镀层性能的影响。相比于镀液单向流动,镀液双向流动实现了铜增量的均匀分布,轴向切片铜的增重率超过7.10%,整块泡沫炭铜的增重率为7.68%;镀层均匀致密,平整光滑,厚度超过5μm,各向分布差异很小;镀层无CuO、Cu_2O杂质;机械性能、电学性能都得到均匀地提高,压缩强度从0.70 MPa增大至1.54 MPa,电导率从700 S/cm增加至1724 S/cm。

Electroless plating with assistance of vacuum and ultrasonic is an effective method to coat copper onto the inner surface of bulk carbon foam. However, it is difficult to obtain uniform copper coating. In present work, the copper coating＇s uniformity was improved by forcing plating solution inside the carbon foam on basis of vacuum and ultrasonic assistance during eletroless plating process. And effect of the flow pattern on plated copper＇s proper- ties was investigated. Compared with one-direction flow of plating solution, a bidirectional flow made the weight gain rate of single cut piece 〉7.10% and the total weight increased up to 7.68%. The copper coating at thickness 〉5μm; with better uniformity was compact, smooth and no CuO or Cu20. The mechanical and electrical properties of Cu/carbon foam were evenly enhanced. The compression strength was increased from 0.70 MPa to 1.54 MPa, and the conduc- tivity from 700 S/cm to 1724 S/cm.