摘要
目的研究环氧树脂体系的黏度及固化性能,为利用树脂传递模塑(RTM)工艺制造发射箱提供理论依据。方法采用旋转黏度计测试了E-51环氧树脂体系的动态黏度和静态黏度,用非等温DSC法和平板小刀法研究了树脂体系的固化行为。结果在60~80℃下70min,树脂体系的黏度仍小于1000mPa·s,符合工艺要求,并推导出了固化温度参数分别为60,125,180℃,以及凝胶时间与温度的关系方程。结论温度区间60~80℃可作为发射箱RTM工艺的操作区间,建议固化工艺制度为60,90.125℃下分别加热固化3.5,2,1h,后处理工艺为180℃下加热固化1h。
The aim of this work was to study the viscosity and curing properties of epoxy resin system, in order to provide a theoretical basis for manufacturing launch box using RTM process. The dynamic viscosity and static viscosity of the E-51epoxy resin system were tested by rotational viscometer. The curing behavior of the resin system was studied using the non-isothermal DSC method and Flat knife method. The viscosity of the resin system was still less than 1000 mPa. s after 70 min at 60~80 ℃, which met the process requirements. And it was deduced that the curing temperature parameter was 60, 125 and 180 ℃ respectively, as well as the relationship equation of gel time and temperature. The temperature range 60~80 ℃ could be used as the operating range for RTM process to manufacture launch box. The recommended curing process of system was heat curing 3.5, 2 and 1 h at 60,90 and 125 ℃respectively, post-treatment process for the next lh at 180 ℃.
出处
《包装工程》
CAS
CSCD
北大核心
2016年第1期115-119,共5页
Packaging Engineering
关键词
RTM
黏度
固化性能
RTM
viscosity
curing performance