耐高温环氧基体树脂的制备及其固化动力学研究

Preparation and Curing Kinetics Study of a Novel Epoxy Matrix Resin with High Temperature Resistance

以多官能环氧树脂JP-80、活性聚酰亚胺增韧剂、活性稀释剂和固化剂为主要原材料,研制了一种综合性能优良的耐高温环氧基体树脂EHMR-1。测试了其在高低温下的拉伸剪切强度,并分析了温度对其黏度、凝胶化时间的影响,利用差示扫描量热法(DSC)研究了胶粘剂的固化动力学。结果表明:新型环氧基体树脂EHMR-1具有良好的耐高温性能,在25℃下的拉伸剪切强度为19.5 MPa,在240℃时拉伸剪切强度为13.6 MPa。同时EHMR-1具有较低的黏度和较高的固化反应活性,可应用于拉挤成型工艺。

A novel epoxy matrix resin EHMR-1 with high temperature resistance was prepared using JP-80 epoxy resin, active polyimide flexibilizer, reactive diluent, and curing agent as raw materials. The tensile shear strength of the EHMR-1 adhesive at high temperature was tested, and the effects of temperature on the viscosity and gel time were analyzed. The curing kinetics of the adhesive was studied by differential scanning calorimetry （DSC）. The results show that the EHMR-1 adhesive has good high temperature resistance, and the tensile shear strength is 19.5 MPa at 25 ℃ and 13.6 MPa at 240 ℃. Meanwhile the EHMR-1 adhesive has low viscosity and high curing reactivity, which can be used in pultrusion moding process.