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剪切速率对BGA无铅焊点抗剪强度的影响

Effect of displacement rates on shear strength of lead-free solder joints of BGA
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摘要 测试了BGA(球栅阵列)无铅焊球Sn-3.0Ag-0.5Cu焊点经65,115,165℃时效保温不同时间后在剪切速率0.5,10 mm/s下的强度,并对BGA焊球在不同的应变速率条件下的抗剪强度进行模拟对比。结果表明:随时效时间的延长,温度的升高,焊点抗剪强度降低,有限元分析(FEA)发现,应变速率越高,焊点抗剪强度越大,Von Mises等效应力越大,等效应变越小。 The shear strengths of Sn-3.0Ag-0.5Cu lead-free solder joints of BGA were tested after aging experiment,the effect of 65 ℃, 115 ℃ and 165 ℃ aging for different times on shear strength of lead-free solder joints of BGA was studied. In order to contrast, ball shear test with different displacement rates was investigated. It was clarified that with the increase of aging time and temperature, the shear strengths of the joints persisted to descend. The finite element analysis results indicated that faster shear speed would result in higher ball shear strength and Von Mises Equivalent stress, but lower equivalent strain.
作者 王海燕
机构地区 菏泽学院蒋震机电工程学院
出处 《焊接技术》 2016年第1期29-32,1,共4页 Welding Technology
基金 国家自然科学基金资助项目(51371083)
关键词 Sn-3.0Ag-0.5Cu 焊点 时效 抗剪强度 有限元分析 Sn-3 0Ag-0 5Cu solder joints aging shear strength finite element analysis
分类号 TG407 [金属学及工艺—焊接]
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参考文献10

  • 1Caroline Bramklev. A survey on the integration of product and pack- age development [J ]. International Journal of Manufacturing Tech- nology and Management, 2010, 3/4(19): 258-278.
  • 2Joel Cugnoni, John Botsis and Jolanta Janczak-Rusch. Size and constraining effects in lead-free solder joints[Jl. Advanced Engi- neering Materials, 2006, 8(3): 184-191.
  • 3Tsai K T, Liu F L, Wong E H, et al. High strain rate testing of solder interconnections [J]. Soldering & Surface Mount Technology, 2006, 18(2): 12-17.
  • 4Alam M O, Wu B Y, Chan Y C, et al. Reliability of BGA solderjoints on the Au/Ni/Cu bond pad-effect of thicknesses of Au and Ni layer[Jl. IEEE Transactions on Device and Materials Reliability, 2006, 6(3): 421-428.
  • 5Chai T C, Yu D Q, John lau, et al. Angled high strain rate shear testing for SnAgCu solder bails [J ]. IEEE Electronic Components and Technology Conference, 2008, 9(8): 623-628.
  • 6Chiang-Ming Chuang, Po-Cheng Shih and Kwang-Lung chanical strength of Sn-3.5Ag-based solders and related [J]. Journal of Electronic Materials, 2004, 33(1) : 1-4. Lin. Me- bondings.
  • 7Islam M N, Ahmed Sharif and Chan Y C. Effect of volume in inter- facial reaction between eutectic Sn-3.5%Ag-O.5%Cu solder and Cu metallization in microelectronic packaging [J ]. Journal of Electronic Materials, 2005, 34(2): 143-149.
  • 8Sridhar Canumalla, Hee-Dong Yang, Puligandla Viswanaham, et al. Package to board Interconneetion shear strength (PBISS): effect of surface finish, PWB build-up layer and chip scale package structure [J ]. IEEE Transactions on Components and Packaging Technologies, 2004, 27(1): 182-190.
  • 9HONG K K, RYU J B and PARKD C Y. Effect of cross-interaction between Ni and Cu on growth kinetics of intermetallic compounds in Ni/Sn/Cu diffusion couples during aging[J]. Journal of Electronic Materials, 2008, 37(1): 61-72.
  • 10CHUANG T H, YEN S F and CHENG M D. Intermetallie reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA pack- ages with Au/Ni surface finishes [J]. Journal of Electronic Ma- terials, 2006, 35(2): 302-309.
焊接技术
2016年 第1期

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