期刊文献+

CY184/D230体系的分段拟合固化反应动力学

Study on the curing kinetics of CY184/D230 system using piecewise fitting method
原文传递
导出
摘要 采用非等温示差扫描量热法对低粘度CY184/D230环氧体系的固化反应动力学进行了研究。采用高级等转化率法(Vyazovkin法)求出活化能,通过Málek法进行了模型拟合动力学分析并采用分段拟合法建立了固化反应动力学模型。结果表明,固化反应动力学符合Sesták-Berggren模型,模型拟合曲线与实验数据十分吻合,证实了分段拟合模型的准确性。 The curing kinetics of low viscosity CY184/D230 epoxy system was investigated by non-isothermal differential scanning calorimetry. The activation energy of was calculated by advanced isoconversional method of Vyazovkin. The kinetics was investigated by the model-fitting M61ek method. The curing kinetic model was obtained using piecewise fitting method. The results indicated that the curing kinetics was compliance with Sest^k-Berggren model. The model fitting curve was consistent with the experimental data and that confirmed the accuracy of the piecewise fitting model.
出处 《热固性树脂》 CAS CSCD 北大核心 2016年第1期15-19,49,共6页 Thermosetting Resin
关键词 非等温示差扫描量热法 固化动力学 活化能 M61ek法 分段拟合 non-isothermal DSC curing kinetics activation energy M tlek method piecewise fitting
  • 相关文献

参考文献4

二级参考文献25

  • 1付中林,尹文华,吴璧耀.双酚F环硫-环氧树脂固化物的性能研究[J].粘接,2005,26(3):7-9. 被引量:5
  • 2赵卫娟,张佐光,孙志杰,张大兴.非等温法研究TGDDM/DDS体系固化反应动力学[J].高分子学报,2006,16(4):564-568. 被引量:47
  • 3Green J, J. Fire Sci, 1992, 10(6) , 470.
  • 4Schut J. H, Plastics World, 1995, 53 (8), 31.
  • 5Deng J, ShiW. F, Eur. Polym. J, 2004, 40(6), 1137.
  • 6Cascaval C. N, Rosu D, Stoleriu A, Polym. Degrad. Stabil, 1997, 55(3), 281.
  • 7Lee J. Y, Choi H. K, Shim M. J, et al, Thermochim.Acta, 2000, 343, 111.
  • 8Pielichowski K, Czub P, Pielichowski J, Polymer, 2000,41, 4381.
  • 9Sbirrazzuoli N, Vyazocvkin S, Thermochim. Acta, 2002,388,289.
  • 10Lee J. Y, Shim M. J, Kim S. W, Materials Chemistry and Physics, 1996, 44, 74.

共引文献34

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部