摘要
采用非等温示差扫描量热法对低粘度CY184/D230环氧体系的固化反应动力学进行了研究。采用高级等转化率法(Vyazovkin法)求出活化能,通过Málek法进行了模型拟合动力学分析并采用分段拟合法建立了固化反应动力学模型。结果表明,固化反应动力学符合Sesták-Berggren模型,模型拟合曲线与实验数据十分吻合,证实了分段拟合模型的准确性。
The curing kinetics of low viscosity CY184/D230 epoxy system was investigated by non-isothermal differential scanning calorimetry. The activation energy of was calculated by advanced isoconversional method of Vyazovkin. The kinetics was investigated by the model-fitting M61ek method. The curing kinetic model was obtained using piecewise fitting method. The results indicated that the curing kinetics was compliance with Sest^k-Berggren model. The model fitting curve was consistent with the experimental data and that confirmed the accuracy of the piecewise fitting model.
出处
《热固性树脂》
CAS
CSCD
北大核心
2016年第1期15-19,49,共6页
Thermosetting Resin