分散剂在TC4上进行电火花小孔加工的性能

Dispersant Performance on TC4 in Small Hole EDM

针对在TC4上进行电火花小孔加工时工件材料去除速度低、相对电极损耗大的问题,为使加工高效低耗,尝试将一定浓度的分散剂聚丙烯酸钠(PAAS)作为电火花小孔工作液,从加工碎屑状态、工作液表面张力等方面进行研究,并应用FLUENT软件对间隙工作液流速进行模拟,分析流场对碎屑的影响。在此基础上进行加工和稳定性实验,得到在TC4上进行电火花小孔加工的最佳工作液配比,改进后材料去除速度最大提高97.56%,加工深径比最大提高了56.94%,研究结果为电火花加工配制合适的工作液提供了参考。

There existed many problems in the small hole EDM process which conducted on TC4, and the chip removal and the relative loss of electrode were especially prominent. In order to solve the problems, a certain concentration of sodium polyacrylate（PAAS） was used as working solution of small hole EDM. Studies were done on many ways such as the particle size of processing scrap and surface tension of working liquid, and simulation analyses was completed about the effects of flow field on processing scarp using software FLUENT. Experiments were processed on the basis of the analyses,therefore, the optimal working fluid ratios in small hole EDM on TC4 was obtained. After the improvements, the maximum material removal rate can be increased by 97.56%, and the depth to diameter ratio is increased by 56. 94%. The research results have reference values on making appropriate working liquid in the small hole EDM.