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飞秒激光切割金属的表面粗糙度 被引量:6

Surface roughness of cutting metal by femtosecond laser
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摘要 为提高激光切割金属的表面质量,用不同工艺参数的飞秒激光单次切割厚度为100μm的铜箔,并采用弱激光表面修复加工方法,取单次切割后最低粗糙度约为694 nm的表面进行弱激光再扫描修复。研究结果表明:高能量飞秒激光切割金属存在热效应,扫描电镜显示表面有颗粒氧化物,实验得到再扫描修复加工的优化工艺参数为:再扫描进给深度为10μm,速度为100μm/s,单脉冲能量为50~100μJ。在最优条件下,再扫描1次的表面粗糙度达220~250 nm,再扫描3次的表面粗糙度小于130 nm。该方法能有效提高飞秒激光切割金属的表面质量。 In order to improve the quality of metal surface cut by laser, 100 μm thick copper foils were cut by femtosecond laser with different parameters. Processing method of weak femtosecond laser rescanning was used to repair the copper surface whose minimum roughness was about 694 nm after the first cut. The results show that there is thermal effect when the copper foils are cut by high intensity femtosecond laser. Granular oxide can be found on the surface by scanning electron microscope. The optimum rescanning parameters of the surface repairing method are as follows: the feed depth is 10 μm, the speed is 100 μm/s and the single pulse energy is 50-100 μJ. Under the optimum condition, the surface roughness can be improved 220-250 nm after single-pass of rescanning. And surface roughness is lower than 130 nm after three times of rescanning process. Thus it can be concluded that the rescanning processing method can improve the surface quality of metal cutting by femtosecond laser effectively.
出处 《中南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2015年第12期4481-4487,共7页 Journal of Central South University:Science and Technology
基金 国家重点基础研究发展计划("973"计划)项目(2011CB013000) 国家自然科学基金资助项目(91123035 51335011 51475481 51475482)~~
关键词 飞秒激光 金属切割 表面粗糙度 再扫描工艺 femtosecond laser metal cutting surface roughness rescanning process
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参考文献14

  • 1HUANG Huan,YANG Lihmei,LIU Jian.Micro-hole drilling with femtosecond fiber laser[C]//Intemational Society for Optics and Photonics.San Francisco,America:SPIE,2013:1456-1459.
  • 2Griffith M,Ensz M,Reckaway D.Femtosecond laser machining of steel[C]//Intemational Society for Optics and Photonics.San Jose,America:SPIE,2003:118-122.
  • 3Inogamov N A,Zhakhovskii V V,Ashitkov S I,et al.Two-temperature relaxation and melting after absorption of femtosecond laser pulse[J].Applied Surface Science,2009,255(24):9712-9716.
  • 4Little D J,Martin A,Peter D,et al.Femtosecond laser modification of fused silica:the effect of writing polarization on Si-O ring structure[J].Optics Express,2008,16(24):20029-20037.
  • 5Week A,Crawford T H R,Wilkinson D S,et al.Laser drilling of high aspect ratio holes in copper with femtosecond,picosecond and nanosecond pulses[J].Applied Physics A:Materials Science & Processing,2008,90(3):537-543,.
  • 6Mahmood A S,Venkatakrishnan K,Bo T.3-D aluminum nanostructure with microhole array synthesized by femtosecond laser radiation for enhanced light extinction[J].Nanoscale Research Letters,2013,8(1):1-8.
  • 7Kandidov V P,Shlenov S A,Kosareva O G.Filamentation of high-power femtosecond laser radiation[J].Quantum Electronics,2009,39(3):205-228.
  • 8CHENG Jian,LIU Changsheng,SHANG Shuo,et al.A review of ultrafast laser materials micromachining[J].Optics & Laser Technology,2013,46(1):88-102.
  • 9何飞,程亚.飞秒激光微加工:激光精密加工领域的新前沿[J].中国激光,2007,34(5):595-622. 被引量:94
  • 10YANG Jianjun,ZHAO Youbo,ZHU Xiaonong.Transition between nonthermal and thermal ablation of metallic targets under the strike of high-fluence ultrashort laser pulses[J].Applied Physics Letters,2006,88(9):094101-094101-3.

二级参考文献195

  • 1周秦岭,刘丽英,徐雷,王文澄,邱建荣,朱从善,干福熹.飞秒激光辐照K9玻璃引起的暗化和折射率变化[J].中国激光,2005,32(1):119-122. 被引量:10
  • 2赵全忠,邱建荣.飞秒激光相干场诱导材料功能微结构[J].物理,2005,34(9):660-665. 被引量:3
  • 3LI C, ARGUMENT M, TSUI Y Y. Micromaching with femtosecond 250nm laser pulses [J]. Proc SPIE,2000,4087:1194 - 1200.
  • 4CHICHKOV B N, MOMMA C, NOLTE S. Femtoaecond, picosecond and nonosecond laser ablation of solids [ J]. Appl Plays, 1996, A63 :109 - 115.
  • 5LIU X,DU D,MUROU G et al. Laser ablation and micromaching with ultrashort laser pulses [J]. IEEE J Q E,1997,33(10) :1706 - 1715.
  • 6PARSONS-KARAVASSILIS D, JONES R, COLE M Jet al. Diode pumped all-solid-state ultrafast Cr:LiSGAF laser oscillator-amplifier system applied to laser ablation [ J]. Opt Commun,2000,175:389 -396.
  • 7PRONKO P P, DUTTA S K, SUIER J. Maching of sub-micron holes using a femtosecond laser at 800nm [J]. Opt Commun, 1995,114:106-110.
  • 8SHAH L,TAWNY J, PdCHARDONSON M et al. Photonic device fabrication in glass by use of nonlinear materials proceeding with a femtosecond laser oscillator [ J ]. Opt Lett ,2001,26 : 1516.
  • 9ZOUBIR A, SHAH L, PdCHARDONSON K. Technology developments towards the practical use of femtosecond laser micro-materials proceeding [J]. Proc SPIE,2002,4760:406 -414.
  • 10SCHAFFER C B,MAZUR E,SQUIER J A et al. Micromaching and material change characterization using femtosecond laser oscillators[ J]. Proc SPIE ,2002,4633 : 112 - 118.

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