摘要
采用粉末冶金法分别制备了相同O含量不同Ni含量的Cu-W合金,通过金相显微镜、XRD、涡流导电仪等对合金材料的显微组织、导电率、硬度、密度等进行了检测。结果表明,在相同O含量情况下,随着Ni含量的增加,Cu-W合金上的孪晶有所减少,各相的集聚程度逐渐增加,这更加说明了Ni有利于改进Cu-W合金的组织性能;Ni的添加对Cu-W合金的性能影响较大,随着Ni含量的增加,Cu-W合金的电导率由40S/m迅速下降到5S/m,而硬度由35HB逐渐上升至68HB,同时烧结后的Cu-W合金的密度也由7.1g/cm3逐渐上升至8.0g/cm3。
CuW alloy with different contents of Ni and the same contents of O were separately prepared by powder metallurgy, and the microstructure, conductivity, hardness and density of the alloys were detected By metallographic microscope, XRD, eddy current conductivity meter. The results show that adding Ni dements can decrease the twin crystals of the Cu-W alloy matrix. Ni is helpful to improve the microstructure of Cu-W alloy. Adding Ni ele ments have great effects on the performance of the alloy. With the increase of Ni content, the electrical conductivity of Cu-W alloy decreased from 40 S/m to 5 S/m. But hardness of Cu-W alloy increased from 35HB to 68HB. Alter sintc ring, the density of Cu-W alloy gradually increased from 7.1 g/cm3 to 8. 0 g/cm3.
基金
稀贵及有色金属先进材料教育部重点实验室开放基金(ZDS2010014B)
昆明理工大学校人才培养基金
昆明理工大学分析测试基金(20140301)
关键词
Cu—W合金
添加元素
硬度
导电率
影响
Cu-W alloy, addition element, hardness, conductivity, effect
