无氰脉冲电镀金-钯-铜合金工艺

Cyanide-Free Pulse Electroplating Process for Au-Pd-Cu Alloy

研究了一种以亚硫酸钠为主配位剂的无氰脉冲电镀金-钯-铜合金工艺。综合考虑镀层表面形貌和镀液沉积速率,得出优选电镀工艺参数为:电流密度0.25 A/dm^2、占空比10%、脉冲频率900 Hz、电镀温度60℃。利用超景深显微镜对镀层表面形貌进行观察分析;利用X射线衍射对镀层物相成分进行分析;同时采用热震法、弯折法检测了镀层结合力;利用维式硬度计测量了镀层硬度。表征结果表明:所得镀层除金、钯、铜元素外,无其它杂质元素;镀层表面细致均匀,孔隙率低,平整性好,无裂纹;镀层硬度高,镀层结合力好。

A cyanide-free sulfite bath pulse electroplating process for Au-Pd-Cu alloy was investigated. Considering the coating’s surface morphology and the plating’s deposition rate, the optimized electroplating parameters were found as follows： current density 0.25 A/dm2, duty ratio 10%, pulse frequency 900 Hz and temperature 60 °C. Tra-depth microscope was used to observe coating’s surface morphology, and X-ray diffraction was used to analyze the phase components. Meanwhile, the coating’s binding force was tested by thermal shock test and root bend test. Furthermore, the coating’s hardness was measured by Vickers. The results show that there are only Au, Pd and Cu in the coating without any impurity elements and the coating has fine and uniform grains, with high hardness, excellent adhesion, low porosity, good smoothness and no cracks.