摘要
以铜、钛等为原料,采用真空热压法制备Cu–Sn–Ti金属结合剂。烧结工艺参数:烧结气氛,真空;烧结温度,640℃;烧结压力,23kN/mm2;保温时间,6min。利用Inspect S50扫描电子显微镜对其微观结构进行表征。实验结果表明:Cu-Sn-Ti金属结合剂中形成了以钛为中心、Cu-Sn相为壳的核/壳结构,即Ti/Ti-Cu/Ti-Cu-Sn/Cu-Sn的微观结构。最后,结合烧结工艺参数、原子特性、热力学分析等,对这种微观结构的形成机理进行了阐述。
Using the vacuum hot-pressing technology,Cu-Sn-Ti metal bond was prepared with copper,titanium etc.,whose sintering process parameters were as follows：vacuum atmosphere,640 ℃,pressure 23kN/mm2 and holding time 6min.Inspect S50 SEM was used to research micro-structure of Cu-Sn-Ti metal bond.The results showed that the corn/shell structure was obtained,whose center was Ti and the edge was Cu-Sn,and that its composition were Ti/Ti-Cu/Ti-Cu-Sn/Cu-Sn.The formation mechanism of micro-structure of Cu-Sn-Ti metal bond was explained with sintering process parameters,atomic properties and thermodynamic analysis etc.
出处
《金刚石与磨料磨具工程》
CAS
2015年第6期19-22,27,共5页
Diamond & Abrasives Engineering
基金
河南省自然科学基金项目(132102210127)
关键词
钛
金属结合剂
制备
机理
titanium
metal bond
preparation
mechanism
