摘要
PCB锡焊机器人目前在电子制造业应用日益广泛。随着对焊接效率和质量要求的不断提高,对其系统设计、工艺、控制等技术提出了新的挑战。从锡焊机器人的构成与功能、锡焊工艺、控制技术和焊点图像检测四方面对锡焊机器人的关键技术进行归纳和总结,分析目前存在的主要技术问题,探讨未来的发展方向。
Nowadays, PCB soldering robots are increasingly widespred in the electronics manufacturing industry. With ever-increasing demands on soldering efficiency and quality, new challenges appear towards its system design, process, control and other technologies. This article summarizes key technologies of soldering robots in four aspects： robost structure and function, soldering technics, control technology and soldering spot image detection. Furthermore, it analyzes existing major technical problems and discusses future development of soldering robots.
出处
《电气自动化》
2016年第1期78-81,共4页
Electrical Automation
关键词
PCB锡焊机器人
锡焊工艺
电烙铁焊接
高周波焊接
激光焊接
焊点图像检测
PCB soldering robot
soldering technics
iron soldering
high frequcy soldering
laser soldering
soldering spot image detection
