电子电气产品构架设计对EMC性能的影响

Effects of Electronic and Electrical Product Architecture Design on EMC

针对产品架构对产品的EMC(Electromagnetic Compatibility)性能产生影响的因素,以电子、电气产品的设计架构为例,从EMS(Electromagnetic Susceptibility)和EMI(Electromagnetic Interference)的角度分析了产品的架构设计,包括产品的接地与浮地、接地的位置与方式、屏蔽线缆的设计、金属外壳的接地设计、数模混合电路的接地等内容。将上述因素对EMC性能的影响详细分析,提出了合理的电子、电气产品的架构设计方式。

Directed to the factors of product architecture which affect product EMC （ electromagnetic compatibility ） , taking the design of electronic and electrical product architecture as an example and in the respects of EMC （ electromagnetic susceptibility } and EMI （electromagnetic interference）, this paper analyzes the product architecture design, including product grounding and floating, grounding location and mode, design of shielding cables, grounding design for metal housing, grounding of mixed signal circuit, etc.. furthermore, it analyzes the influence of above-mentioned factors on the EMC in detail, and introduces a reasonable architecture design method for electronic and electrical products.