摘要
发光二极管(LED)能将电能高效转化为光能,在照明领域的应用得到了迅速发展,对LED封装材料的要求也越来越高。普通环氧树脂在耐紫外辐射、耐热老化性能方面的缺陷限制了其作为封装材料的发展;有机硅的"杂化分子"结构使材料有稳定的光学性能、可调的力学性能和优异的整体性能,因此有机硅材料在LED封装领域发展前景广阔,吸引了越来越多科研人员的关注。另外,为满足不断发展的LED封装的要求,需要对有机硅进行改性。
Light-emitting diodes（LEDs）could effectively convert electricity into light.With the rapid development of LEDs in the lighting market,there are increasing requirements for packaging materials.Recently,common epoxy resin has been limited to use as packaging materials because of its poor resistance to UV and heat aging.However,the structure of＂hybrid molecule＂gives organic silicone materials stable optical properties,tunable mechanical properties and excellent overall performance.In the future,organic silicone material would be widely used in the field of LED packaging,which has attracted considerable research attention.Meanwhile,organic silicone materials also need modification to meet the growing requirements for LED packaging.
出处
《化工新型材料》
CAS
CSCD
北大核心
2016年第1期28-30,共3页
New Chemical Materials
关键词
发光二极管
封装材料
环氧树脂
有机硅
light emitting diode
packaging material
epoxy resin
silicone
