AlN/CuTi体系润湿性及界面反应

Wettability and Interfacial Reaction of AlN/CuTi System

采用座滴法系统研究了AlN/CuTi体系在真空中的润湿性,结果表明,随着Ti含量的增大、温度升高和保温时间延长,体系的润湿性均得到改善。当Ti含量(质量分数)高于15%时,在1200℃体系的润湿角减小到10o以下。在AlN/Cu10Ti(Ti含量为10%)体系中,在1200℃保温20min,Ti扩散至AlN侧并与之发生反应,在钎料和AlN之间生成了厚度约50μm主要由TiN组成的反应层,促进了CuTi钎料和陶瓷基体的界面结合,改善了体系的润湿性。但由于残余应力过大,在AlN中靠近反应层处生成了裂纹。

Wetting behavior of AlN by CuTi alloys has been studied in vacuum through sessile drop technique. The results show that the wettability is improved with increasing the Ti content, and the contact angles also decrease with either raising the temperature or prolonging the holding time. The contact angles of the AlN/CuTi system decrease to the values less than 10o at 1200 oC by adding 15 wt% or more Ti. In AlN/Cu10Ti (Ti content is 10 wt%) system, Ti element diffuses to and reacts with AlN, and a reaction layer mainly composed of TiN with the thickness of about 50 μm forms between the CuTi alloy and the AlN substrate after holding for 20 min at 1200 oC. The formation of the reaction layer improves the interfacial bonding and the wettability of the system. Cracks are generated in the AlN substrate close to the reaction layer due to the residual stress.