溅射钽环件用钽凸台生产工艺研究

Research on Production Process of Tantalum Boss Used for Sputtering Tantalum Coil

溅射钽环件应用于半导体制造的金属化工艺,其作用是在溅射过程中起到聚焦和净化的作用。钽凸台是溅射钽环件的主要部件,其材料利用率以及加工效率对溅射钽环件的加工成本影响很大。采用先挤压成型后机械加工的新工艺代替国外全部采用机械加工的工艺,将材料利用率由41.96%提高到77.90%,并且极大地提高了加工效率。这种新工艺的主要难点是模具结构设计、模具材料选择以及原材料的制备。这种新工艺已得到实践验证,产品完全满足国外用户的要求。

The role of the sputtering tantalum coil which is applied in the metallization technology of semiconductor manufacturing is to focus and purify during the sputtering process. Tantalum boss is the main component of sputtering tantalum coil, whose yield and process efficiency has a tremendous influence on the cost of sputtering tantalum coil. Using the new process of machining after punching forming to replace machining only in abroad increases the material direct yield from 41.96% to 77.90%, as well as improves processing efficiency. The main difficulty of this new process is the design of die structure, selection of die material, and preparation of raw materials. This new process has been tested and verified in practice and the products made by this process could fully meet the requirements of overseas customers.