时间间隔测量在可焊性测试仪校准中的应用

The application of time interval measurement in solderability tester calibration

可焊性测试仪是电子元器件在生产过程中筛选复验和装机前进行可焊性测试的仪器,时间参量是可焊性测试仪的重要指标,主要针对可焊性测试仪的试件浸渍持续时间校准方法开展研究,对制造商采用的计数法进行分析后,将时间间隔校准方法应用于元器件可焊性测试仪时间参量校准中,并分析和评定了试件浸渍持续时间的测量不确定度。研究结果表明,与传统的计数法相比,本文采用的时间间隔测量方法操作简单,可以直观地给出测量结果,解决了可焊性测试仪时间参量的校准问题。

The solderability tester is an instrument which is used to test the solderability of the electronic components during the producing process,screening retests and before loading the system.Time parameter is an important index for solderability tester.Mainly on the specimen dipping duration time for research is discussed.After analysis the traditional counting method,we put the time interval measurement into the calibration for component solderability tester,and assess the measurement uncertainty of specimen dipping duration time.In this paper,the results show that compared to the traditional method,time interval measurement is simpler and more obvious.The problem of calibration for solderability tester is solved.