PCBA R0402电阻气泡工艺改善研究

Study on the process improvement of R0402 PCBA resistance bubble

简述PCBA电子装联回流焊接工艺过程中RO402电阻气泡(void)产生的机理,叙述了气泡产生的一些原因,以及为了预防和减少气泡应当采取的措施。文章对出现气泡后如何进行分析、改善提供了方法上的建议和参考。

This paper briefly introduces the mechanism of PCBA resistance RO402（void） in the process of the reflow soldering process,and describes the reasons of the bubble,and the measures to prevent and reduce the bubbles.This article will provide a reference for the analysis and improvement of the bubble.