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Fabrication and Characterization of 1700 V 4H-SiC Vertical Double-Implanted Metal-Oxide-Semiconductor Field-Effect Transistors

Fabrication and Characterization of 1700 V 4H-SiC Vertical Double-Implanted Metal-Oxide-Semiconductor Field-Effect Transistors
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摘要 The fabrication and characterization of 1700 V 7 A 4H-SiC vertical double-implanted metal-oxide-semiconductor field-effect transistors (VDMOSFETs) are reported. The drift layer is 17μm in thickness with 5 × 10^15 cm^-3 n-type doping, and the channel length is 1μm. The MOSFETs show a peak mobility of 17cm2/V.s and a typical threshold voltage of 3 V. The active area of 0.028cm2 delivers a forward drain current of 7A at Vcs = 22 V and VDS= 15 V. The specific on-resistance (Ron,sv) is 18mΩ.cm2 at VGS= 22 V and the blocking voltage is 1975 V (IDS 〈 lOOnA) at VGS = 0 V. The fabrication and characterization of 1700 V 7 A 4H-SiC vertical double-implanted metal-oxide-semiconductor field-effect transistors (VDMOSFETs) are reported. The drift layer is 17μm in thickness with 5 × 10^15 cm^-3 n-type doping, and the channel length is 1μm. The MOSFETs show a peak mobility of 17cm2/V.s and a typical threshold voltage of 3 V. The active area of 0.028cm2 delivers a forward drain current of 7A at Vcs = 22 V and VDS= 15 V. The specific on-resistance (Ron,sv) is 18mΩ.cm2 at VGS= 22 V and the blocking voltage is 1975 V (IDS 〈 lOOnA) at VGS = 0 V.
出处 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第12期109-112,共4页 中国物理快报(英文版)
基金 Supported by the National Science and Technology Major Project of the Ministry of Science and Technology of China under Grant No 2013ZX02305
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参考文献18

  • 1Millan J, Godignon P, Perpina X, Perez-Tomas A and Rebollo J 2014 IEEE Trans. Power Electron. 29 2155.
  • 2Ryu S H, Krishnaswami S, Hull B, Richmond, J Agarwal A and Hefner A 2006 Proc. 20th Int. Symp. Power Semicond. Devices ICs (Naples, Italy June 4–8 2006) p 1.
  • 3Cheng L, Agarwal A K, Schupbach M, Gajewski D A and Lichtenwalner D J 2013 Proc. 25th Int. Symp. Power Semicond. Devices ICs (Kanazawa, Japan May 26–30 2013) p 47.
  • 4Kono H, Takao K, Suzuki T and Shinohe T 2014 Proc. 26th Int. Symp. Power Semicond. Devices ICs (Hawaii, America June 15–19 2014) p 289.
  • 5Song Q W, Zhang Y M, Han J S, Philip T, Sima D Zhang Y M, Tang X Y and Guo H 2013 Chin. Phys. B 22 027302.
  • 6Zhang Y M http://kdx. xidian.edu.cn/info/1039/1198.htm? from=timeline&isappinstalled=0. [2015].
  • 7Huo R B, Bai Y, Shen H J and Li C Z 2014 Proc. 12th IEEE Int. Conf. Solid-state and Integrated Circuit Technology (Guilin, China Oct. 28–31 2014) p 1282.
  • 8Huo R B, Shen H J, Bai Y, Zhang X F and Li C Z 2014 Proc. 12th IEEE Int. Conf. Solid-state and Integrated Circuit Technology (Guilin, China Oct. 28–31 2014) p 1279.
  • 9Nakazawa S, Okuda T, Suda J and Nakamura T 2015 IEEE Trans. Electron Devices 62 309.
  • 10Chowdhury S, Yamamoto K, Hitchcock C and Chow T P 2015 Mater. Sci. Forum 821 500.

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