防止纯锡镀层变色的电镀参数优化

Process Parameter Optimization to Prevent Pure Tin Plating Discoloration

纯锡电镀工艺主要有锡晶须、镀层变色等问题,其中镀层变色严重影响器件的可焊性。通过分析纯锡电镀各参数对镀层变色的影响,设计了工艺参数的优化实验方案,然后按照方案进行样品制作、评价和数据分析,得到能够防止纯锡镀层变色的最优参数,并对实验结果进行验证。经验证的实验结果为电流密度为12A/dm^2,电镀温度为55℃,电镀液H^+浓度为1.1 mol/L,电镀液Sn^(2+)浓度为65g/L。研究成果提高了无铅产品的可靠性,从而增强了产品在市场上的竞争性。

Tin whisker,tin coating discoloration and other issues have influences on the pure tin plating process,in which,coating discoloration severely affect devices＇ solderability.The process and related parameters about pure tin electroplating were analyzed in this paper,the optimization program of process parameters were designed to make and evaluate experiments samples and analyze the data,and then the improvement measures were proposed to solve discoloration of pure tin plating,at last the results were verified.The conclusions were shown that The best plating process parameters were instructed that current density was 12 A/dm^2,plating temperature was 55 ℃,H^＋ concentration was1.1 mol/L,Sn^2＋ concentration was 65 g/L.The achievements of this paper have been applied in electronics products,these lead-free products＇ reliability was improved,thereby their market competitiveness was enhanced.