摘要
引线框架是集成电路封装中必不可少的材料,它作为集成电路的芯片载体,起到了和外部导通连接的作用,因此要求引线框架具有优良的导电性能、导热性能以及机械性能,还要求具有抗氧化性、抗腐蚀性及高可靠性;在集成电路封装过程中,塑封器件极易发生分层,严重影响IC器件的可靠性。分析了引线框架对封装可靠性的影响以及一些提高封装质量的方法。
The lead frame is essential material for integrated circuit packaging,as carrier of integrated circuit chip,that played an important role with external conduction connection,so lead frame has excellent electric conductivity,thermal conductivity and mechanical properties,also has the oxidation resistance,corrosion resistance and high reliability.In the process of integrated circuit packaging,the product easily occurred delamination,seriously affecting the reliability of IC device.In this paper,briefly analyzed the effect of lead frame to the packaging reliability and some methods to improve the quality of packaging.
出处
《电子工业专用设备》
2015年第12期28-31,共4页
Equipment for Electronic Products Manufacturing
关键词
封装
引线框架
分层
可靠性
Assembly
Lead frame
Delamination
Reliability
