摘要
设计并合成了一种环氧树脂潜伏性固化剂二苯基双胍。采用FTIR和1HNMR表征了固化剂的化学结构,并通过DSC分析得到环氧树脂与固化剂的最佳质量配比为5∶1,固化活性实验及凝胶实验分析得到最佳固化温度为130℃,储存期为室温下30 d,拉伸实验分析了固化物的抗拉强度可达38.07 MPa,采用TG测试得到固化物的热分解温度超过270℃。结果表明,与双氰胺环氧树脂固化体系相比,该固化剂和环氧树脂有更好的相容性,潜伏性良好,其固化温度降低30℃以上,固化物有更优异的力学性能和良好的热稳定性。
A new latent curing agent for epoxy resin bis-phenylbiguanide was designed and synthesized.The chemical structure of curing agent was characterized by FTIR,1HNMR. The optimum ratio of epoxy resin and curing agent was 5 ∶ 1 under the assistance of DSC. The optimum curing temperature and storage time in room temperature was 130 ℃ and 30 d obtained by curing activity test and gel test,respectively. Tensile strength of cured epoxy resin was 38. 07 MPa,which was analyzed by tesion test.Thermal decomposition temperature of the cured epoxy was exceeded 270 ℃ with the help of TG.Comparing with dicy / epoxy resin curing system,the new agent has better compatibility with epoxy resin. Its latency performance was fine and curing temperature was decreased more than 30 ℃ and the cured epoxy had excellent mechanical properties and good thermostabilities.
出处
《精细化工》
EI
CAS
CSCD
北大核心
2016年第2期224-230,共7页
Fine Chemicals
基金
国家自然科学基金资助项目(51173204
2014A030310412)
广东省自然科学基金(2015A030313822
2015A030313799)
广东省科技计划项目(2015B090915004)~~
关键词
二苯基双胍
环氧树脂
潜伏性固化剂
热稳定性
力学性能
粘合剂
bis-phenylbiguanide
epoxy resin
latent curing agent
thermostabilities
mechanical properties
adhesives
