摘要
随着信号频率和PCB布线密度的不断提高,PCB中的过孔结构对信号完整性的影响愈加凸显。过孔设计的合理性会极大地影响PCB上信号的传输质量。本文基于SIwave和Designer仿真软件,建立了用于差分过孔分析的PCB结构模型,针对不同的孔径、焊盘尺寸、反焊盘尺寸、过孔长度以及是否具有残桩、非功能焊盘的情况,分别提取了频域S参数,并仿真得到了相应的时域TDR波形,较为全面地分析了过孔结构参数对传输信号的影响,给出了PCB过孔设计的建议。通过实际PCB中差分线上过孔的分析,验证了过孔设计建议的合理性。
With the increasement of signal frequency and PCB wiring density,the effect of PCB via structure on signal integrity is more and more obvious.The rationality of via design can greatly affect the transmission quality of PCB signal.Based on SIwave and Designer simulation software,the PCB structure model for differential via analysis is established.According to different via radius,pad size,antipad size,via length and whether it has a stub,nonfunctional pads,the S parameters in the frequency domain are extracted respectively and the TDR waveforms of the corresponding time domain are obtained.The influence of via structural parameters on the transmitted signal is analyzed in a comprehensive way,and suggestions on the PCB via design are proposed.Through the analysis of via on the differential line of actual PCB,the rationality of the proposed via design is verified.
出处
《电子测量技术》
2016年第1期40-44,53,共6页
Electronic Measurement Technology
基金
国家自然科学基金(61201092)
辽宁省自然科学基金(201202015)
辽宁省高等学校优秀人才支持计划(LJQ2013047)
