期刊文献+

SOPC技术在可见光通信中的应用

Application of SOPC technology in visible light communication
下载PDF
导出
摘要 针对传统有线通信布线铺设难、成本高、设备移动不便以及无线射频通信频谱资源紧张、存在电磁辐射等问题,提出了一种基于可编程片上系统技术(System on a Programmable Chip,SOPC),利用可见光作为传输介质进行无线光通信传输数据的应用方案。介绍了该方案的设计原理和实现方法,并进行实验测试,试验结果表明,该方案可行,且能够达到光能量与通信复用的目的。 The traditional cable communication has shortages such as difficult routing, high cost, poor equip- ment mobility, strained wireless radio frequency spectrum resource, electromagnetic radiation and so on. To solve these problems, an application scheme of wireless light communication is proposed, which is based on SOPC (System on a Programmable Chip), with visible light as the transmission medium. The design principle and realization method are introduced, and the experimental results show that it is feasible, and achieve the purpose of multiplexing of optical energy and communication.
出处 《光通信技术》 北大核心 2016年第2期29-32,共4页 Optical Communication Technology
基金 广西科学研究与技术开发计划项目(桂科转1599004-27)资助 桂林市科学研究与技术开发计划项目(科技攻关20150102-10)资助 广西高校专利倍增计划项目(KY2015ZL154)资助
关键词 NIOS II软核 可见光通信 FPGA 白光LED SOPC Nios II soft core, visible light communication, FPGA, white LED, SOPC
  • 相关文献

参考文献7

二级参考文献70

  • 1许银帆,黄星星,李荣玲,迟楠.基于LED可见光通信的室内定位技术研究[J].中国照明电器,2014(4):11-15. 被引量:24
  • 2倪明辉,周军,杨庚.USB在FPGA控制的高速数据采集系统中的应用[J].计算机测量与控制,2006,14(2):268-271. 被引量:31
  • 3丁德强,柯熙政.可见光通信及其关键技术研究[J].半导体光电,2006,27(2):114-117. 被引量:82
  • 4丁德强,柯熙政,李建勋.VLC系统的光源布局设计与仿真研究[J].光电工程,2007,34(1):131-134. 被引量:38
  • 5陈明祥,马泽涛,刘胜.LED感应局部加热封装试验研究[J].发光学报,2007,28(2):241-245. 被引量:12
  • 6Narendran N, Bullough J D, Maliyagoda N, et al. what is useful life for white light LEDs [J]. J.lllum.Eng.Soc(S0099-4480), 2001, 20(1): 57-67.
  • 7Steigerwald Daniel A, Bhat Jerome C, Collins Dave, et al. Illumination With Solid State Lighting Technology [J]. IEEE Journal on Selected Topics in Quantum Eleetronics(S1077-260X), 2002, 8(2): 310-320.
  • 8Arik Mehmet, Petroskl James, Weaver Stanton. Thermal Challenges in the future generation solid state lighting applications: Light emitting diodes [C]// The Eighth Intersociety Conference on Thermal and Thermomechanieal Phenomena in Electronic Systems, San Diego, May 30-June 1, 2002: 113-120.
  • 9Zhang X W, Wong E H, Lee Charles, et al. Thermo-mechanical finite element analysis in a multichip build up substrate based package design [J]. Mieroeleetronics Reliability(S0026-2714), 2004, 44(4): 611-619.
  • 10Oliver Kuckmann. High power LED arrays special requirements on packaging technology [J]. Proc. of SPIE(S0277-786X), 2006, 6134(4): 1-8.

共引文献48

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部