灌封结合力影响因素分析

Analysis of Effects on the Potting Binding Force

根据实际生产用的工艺方法及可能对灌封结果造成影响的一些工艺条件,按照GB/T 7124-2008胶黏剂拉伸剪切强度的测定方法进行对接试片的制作与检测。对影响高压器件灌封结合力的大多数因素如温湿度、固化温度、清洗效果及偶联剂的涂覆等进行分析,结果明确了偶联剂的使用是最重要的影响因素;在严格驱潮的条件下,湿度因素影响较小。在既定工艺条件下,清洗及固化条件对灌封结果影响较小。

In terms of the actually producing process and some process conditions that may affect potting binding force, according to‘GB/T7124-2008 Adhesives-Determination of tensile lap-shear strength of rigid-to-rigid bonded assemblies ＇,the butt joint specimens were made and inspected.Most factors that affects the high-voltage components potting binding force, such as temperature and humidity, curing temperature, cleaning effect and coating of the coupling agent etc were analyzed. The results showed that coating of the coupling agent was the most important influence factor, then were the temperature and humidity; cleaning and curing had little effect on the condition of rigorous drying and established process conditions.