摘要
采用高温熔融水淬的方法,制备了无铅低熔点耐酸玻璃粉,研究了化学组分及其含量对无铅玻璃耐酸性的影响。结果表明:当质量分数w(Bi_2O_3)为50%~60%,w(B_2O_3)为10%~12%,w(SiO_2)为20%~30%,w(Al_2O_3)为3%~5%,w(Li_2O)为1%~3%时,可获得膨胀系数在(65~75)×10^(–7)/℃,软化点在480~490℃,玻化温度在(600±10)℃,附着力优良,在质量分数5%的H_2SO_4中浸泡48 h,玻璃的光泽基本不变的无铅玻璃粉。
Lead-free glass was synthesized through high-temperature melting, water quenching and grinding. The effect of the composition and content on the acid resistance property was researched. The results indicate that when the glass is synthesized with mass fraction of 50%-60% Bi2O3, 10%-12% B2O3, 20%-30% SiO2, 3%-5% Al2O3 and 1%-3% Li2O. The acid resistant and lower melting point lead-free glass is obtained, with the thermal expansion coefficient of(6575)×10–7/℃, the soften point of 480490 ℃, and the glass transition temperature of(600±10) ℃. Glassy luster is invariant after dipping in 5%(mass fraction) H2SO4 for 48 h.
出处
《电子元件与材料》
CAS
CSCD
2016年第2期56-59,共4页
Electronic Components And Materials
关键词
低温烧结
耐酸
无铅玻璃粉
包封料
厚膜电路
铋酸盐
lower temperature sintering
acid-resisting
lead-free glass powders
package paste
film electrocircuit
bismuthate