摘要
焊盘作为线路板与电子元器件焊接装联的必要媒介,其焊接的可靠性是影响最终产品的寿命和可靠性的重要因素。本文以三家供应商的无胶挠性板材为例,运用万能实验拉力机在不同条件下对焊盘进行拉脱,从材料种类、铜厚、焊盘尺寸、焊接温度、焊接次数五个方面考察了其对焊盘拉脱强度的影响;通过金相显微镜和热重分析讨论了挠性板材在焊接过程中焊盘脱落的机制;最后运用正交分析法得出了焊接过程中的主要影响因素是焊接温度及焊接次数,在此基础上给出了参数范围,优化了工艺设计。
As an important media of electronic components mounting, pads are vitally important to the life and reliability of the final products. In this paper, a universal tensile testing machine was employed to comprehensively survey the impact of the type of material, copper thickness, pad size, welding temperature and welding times on the pads＇ pull-off strength from three suppliers＇ fl exible substrates; a metallurgical microscope and TGA were further used to discuss the pads＇ pull-off failure mechanism; orthogonal analysis method was then employed to obtain that the main factors during the welding process are welding temperature and welding times, and on the basis of above, the range of parameters were fi nally given to optimize the process design.
出处
《印制电路信息》
2016年第2期11-17,共7页
Printed Circuit Information
关键词
焊盘
挠性电路板
失效原因
控制
Pad
Flexible Printed Circuit Board
Failure Mechanism
Control
