摘要
覆铜板表面油状污点,是覆铜板表观的重要缺陷,此缺陷是影响PCB客户使用质量的重要隐患之一。本文基于覆铜板表面油状污点缺陷的认识,从形成机理和形成过程探讨此缺陷的形成,并探讨解决方法。
CCL surface oily stain defect is an important defect of Copper Clad laminate surface. The defect is one of the important quality hidden trouble of PCB customers using PCB. In this paper, we will discuss the formation of the defect from the forming mechanism and forming process which based on the understanding of the CCL surface oily stain defect, and discuss the solution.
出处
《印制电路信息》
2016年第2期23-24,33,共3页
Printed Circuit Information
关键词
覆铜板
油点
缺陷
Copper Clad Laminate
Oily Point
Defect