摘要
目前IPC-TM-650标准测试方法已无法有效帮助PCB厂评估CCL的尺寸稳定性。本文对IPC-TM-650测试方法和PCB生产流程进行分析,提出一种新的尺寸稳定性评估方法,并通过测试样品和PCB模型验证该新方法的有效性。
The current standard test method of IPC-TM-650 is unable to help PCB manufacturer to evaluate the CCL＇s dimensional stability effectively. In this paper, a new evaluation method of dimensional stability is put forward by analyzing test method of IPC-TM-650 and PCB production processes. Meanwhile, the effectiveness of the new method is verifi ed by the test sample and the PCB model.
出处
《印制电路信息》
2016年第2期25-28,50,共5页
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