摘要
在铜表面化学镀覆一层镍,再进行化学镀镍钯合金层,研究了络合剂、还原剂和工艺参数对合金镀层钯含量及沉积速率的影响,得到较优合金镀液配方及工艺条件。采用扫描电子显微镜、结合力测试、中性盐雾试验等分析手段测试了镀层性能,所得镀层光亮,具有良好的耐蚀性和结合力。
Electroless nickel-palladium alloy on the copper covered with Ni coating has been achieved. The effects of complexant, reductant and process parameters on deposition rate and content of palladium in the alloy coating were studied. The optimal bath formula and process conditions for electroless were concluded. The properties of the coating were examined by SEM, and adhesion test, neutral salt spray test were made. The plating obtained is bright, which has good adhesion and corrosion resistance.
出处
《印制电路信息》
2016年第2期47-50,共4页
Printed Circuit Information
关键词
印制电路板
表面涂覆层
化学镀镍
化学镀镍钯合金
阻挡层
PCB
Surface Coating
Electroless Nickel
Electroless Nickel-Palladium Alloy
Barrier Layer