IGBT模块键合线失效研究

Research on Failures of Bonding Wire in IGBTs Module

新能源技术的发展对功率变流装置的性能提出了更高的要求,IGBT模块作为变流器的核心器件,其可靠性受到了越来越广泛的重视。现有研究表明,恶劣的工作环境加速了器件的老化和失效,因此,深入研究IGBT模块的老化和失效机理是功率器件应用中需亟待解决的问题。以IGBT模块的键合线为研究对象,在建立IGBT模块电-热-力多场耦合模型的基础上,对正常工作和部分键合线脱落时的温度和剪切应力进行了综合分析,指出剪切力是键合线疲劳和失效的直接原因。最后,对比传统铝键合线模型,采用铜作为键合线材料,可以进一步提高模块的可靠性。本研究为进一步分析键合线疲劳,研究IGBT模块的失效形式和寿命提供了参考。

With the development of renewable energy technology, the requirements of reliabilities of power converters become higher. As the core devices of power converters, the reliability of IGBT module has been paid more and more attention. The existing researches show that the bad working environment accelerates the aging and failure of the device,so the research on the aging and failure mechanism of IGBTs module becomes more and more urgent. In this paper, IGBT module is the research object. Based on electro-thermo-mechanical coupling physical model of IGBTs module, a comprehensive analysis of the temperature and stress of the bonding wires is carried out on normal condition and partial bonding wires failure. It is pointed out that the shear stress is the direct cause of the fatigue and failure of the bonding wires. Finally, comparing with the traditional aluminum bonding wire model, the reliability of IGBTs module can be improved by using copper as the bonding wires material. The research of this paper provides a reference for the further analysis of bonding wires fatigue and study on the failure mode and the life of the IGBT module.