基于激光电子散斑干涉技术的电路热变形研究

Circuit Board Thermal Distortion Research Based on Laser Electronic Speckle Pattern Interferometry

在工作状态下,由于电子元器件的发热会导致电路板热变形,影响整个电路系统的可靠性和稳定性。针对此问题,本文提出了一种基于激光电子散斑技术的电路热变形研究方法。在获得电子散斑干涉条纹图的基础上,采用局部傅里叶变换滤波以消除图像噪声对条纹图相位提取的影响。同时,为有效地提取电子散斑干涉相位,设计了一种基于方向耦合的梯度矢量场骨架线提取算法;并搭建了双光束光学测量系统,分析了测量原理;最后针对升温和冷却过程中电路变形情况进行了相关实验研究。实验结果表明:本文所述方法可以有效地提取电子散斑干涉条纹图的骨架线,反映电路系统的热变形情况。

In working status,the reliability and stability of whole circuit system will be affected as the result of circuit board thermal distortion caused by the heat of electronic components. In order to solve this problem,a circuit board thermal distortion research method based on laser electronic speckle pattern interferometry is proposed in this paper.On the basis of electronic speckle interference fringe figure,the local Fourier transform filter is used to eliminate the influence of image noise to fringe phase extraction.At the same time,a gradient vector field skeleton extraction algorithm based on coupling direction is designed to effectively extract the electronic speckle interference phase. And a double beam optical measurement system is set up and the measuring principle is analyzed.Finally,the related experiments about circuit distortion in the process of heating and cooling are carried on. Experimental results show that the method described in this article can effectively extract the skeleton line of electronic speckle interference fringe figure and reflect the thermal distortion of the circuit system.