均热板散热性能实验研究

Experimental Research on Heat Dissipation Performance of Vapor Chamber

均热板作为一种新型的高效散热技术,具有热导率高、均温性良好等优点,越来越多地应用于机载电子设备。文中介绍了均热板散热原理,针对均热板和相同尺寸电子设备模块壳体在不同工况下进行散热性能实验研究,对比测试了两者均温效果和散热效果。测试结果表明,均热板的均温效果优于同尺寸常规铝材模块壳体;功耗及热流密度越大,均热板散热优势越明显;采用不同散热方式,均热板内芯片与模块壳体内芯片的温差相同;多芯片时,总功耗越高芯片表面温度越高,芯片热流密度越集中,芯片表面温度越高。当达到散热极限时,应设计为多芯片,低热流密度的形式,均热板可以达到更好的散热效果。

As a new type high-efficiency heat dissipation technique, vapor chamber are increasingly applied to airborne electronic equipments because of its high heat conductivity and well temperature uniformity. This paper introduces heat dissipation principle of vapor chamber. Experimental research of heat dissipation performance aimming at vapor chamber and the same size module shell of electronic equipment is carried out under different work condition. Temperature uniformity and heat dissipation effect is contrastively tested. The results show that uniform temperature effect of vapor chamber is excelled to the same size normal module shell with aluminium material. The bigger power consumption and heat flux density, the more advantage heat dissipation of vapor chamber. The temperature difference is the same between chip in vapor chamber and chip in module shell when adopting different heat dissipation mode. The higher total power consumption,the higher surface temperature and the more concentrative of heat flux density, the higher surface temperature on multi-chips. Multi-chips and low heat flux density should be designed to realize better heat dissipation effect of vapor chamber when it reaches heat dissipation limit.