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填充型聚乙烯基导热复合材料研究进展 被引量:8

Research Progress of Filled Thermally Conductive Polyethylene-based Composites
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摘要 以聚乙烯(PE)基体为主线,综述了近二十年来国内外以金属、金属氧化物、氮化物、碳系填料等填充聚乙烯制备导热复合材料的研究进展。最后指出了当前以PE基材为代表的填充型聚合物基导热复合材料中存在的主要问题并对其发展方向进行了展望。 The research progress of thermally conductive polyethylene-based composites with metals, metal oxides, nitrides, carbon-based materials as fillers was reviewed. Finally, some existent problems of the filled thermally conductive polymer composites were presented, and their development direction was expected.
出处 《塑料工业》 CAS CSCD 北大核心 2016年第2期13-18,共6页 China Plastics Industry
基金 高分子材料工程国家重点实验室开放课题基金资助(sklpme 2014-4-34)
关键词 聚乙烯 填充 复合材料 热导率 力学性能 Polyethylene Filling Composites Thermal Conductivity Mechanical Properties
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  • 1HAN Z, FINA A. Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review [J]. Prog Polym Sci, 2011, 36 (7): 914-944.
  • 2马传国,容敏智,章明秋.导热高分子复合材料的研究与应用[J].材料工程,2002,30(7):40-45. 被引量:102
  • 3TAVMAN I H. Thermal and mechanical properties of alumi- num powder-filled high-density polyethylene composites [ J]. J Appl Polym Sci, 1996, 62 (12) : 2161-2167.
  • 4KUMLUTAS D, TAVMAN I H, COBAN M T. Thermal conductivity of particle filled polyethylene composite materials [J]. Compos Sci Technol, 2003, 63 (1): 113-117.
  • 5ZHOU W. Thermal and dielectric properties of the aluminum particle reinforced linear low-density polyethylene composites [J]. PolymEngSci, 2011, 51 (5): 917-924.
  • 6LUYT A S, MOLEFI J A, KRUMP H. Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites [J] Polym Degrad Stab, 2006, 91 (7) : 1629-1636.
  • 7童铭康,吴秀平,戚嵘嵘,张海英.铜粉填充UHMWPE导热材料性能的研究[J].工程塑料应用,2010,38(7):8-11. 被引量:15
  • 8林凌剑,盖国胜,杨玉芬.超高分子量聚乙烯基复合材料导热性能研究[J].中国粉体技术,2010,16(6):33-35. 被引量:4
  • 9RUSU M, SOFINA N, RUSU D, et al. Properties of iron powder filled high density polyethylene [J]. J Polym Eng, 2001, 21 (5): 469-487.
  • 10KUMLUTAS D, TAVMAN I H. A numerical and experi- mental study on thermal conductivity of particle filled polymer composites [J]. J Thermoplast Compos Mater, 2006, 19: 441-455.

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