微槽道及其在电子器件散热中的应用

Microchannel and its Application in Heat Dissipation of Electronic Devices

介绍了微槽道内流体流动及换热的特点,以及微槽道热沉的结构型式、加工工艺和流体工质。流体在微槽道内流动与换热,具有尺度小、雷诺数低、表面传热系数高和压降大等特点。微槽道可在热导率高的金属材料或半导体材料上成型。同时,还介绍了目前计算机微处理器、大功率电力电子器件和大功率LED常用的散热方案,并探讨了微槽道热沉应用于这些电子器件散热所具有的优点。与目前常用的散热方案相比,微槽道热沉可有效减小散热部件所需的散热空间,满足电子产品持续小型化的要求。在热流密度不断提高,常用散热方案无法满足要求的情况下,微槽道还为电子器件的散热提供了一种可供选择的解决方案。

Characteristics of fluid flow and heat transfer in microchannels, such as micro-scale, low Reynolds number, and high convective heat transfer coefficient, high pressure losses etc, are all introduced. Microchannels can be fabricated on metals with high thermal conductivity, or semiconductor materials such as silicon. Types of mierochannel heat sink struc- ture, fabrication processes and fluids used in microchannel are also discussed. Meanwhile, heat dissipation solutions adopted for electronic devices such as microprocessors, large power electric and electronic devices, large power LEDs currently used. are presented, and advantage using microchannel is discussed. Comparing with heat dissipation methods currently used, mi- crochannel heat sink can reduce the needed space for dissipating the heat, and meet the continuous miniaturization require- ments for electronic products. Moreover, with increasingly high heat flux, current methods for heat dissipation may not be able to meet the requirements. In this case, microchannel might be a possible solution for the heat dissipation.