电子器件封装中引线键合质量的检测方法

Review on Detection of Bond Wires in Electronic Components

引线键合是半导体封装中实现芯片与封装引脚之间连接的关键技术,近年来半导体产业对更高的集成度、更高的可靠性和更低的成本等方面的迫切需求,对引线键合技术提出了更高的要求,因此引线键合的质量检测成为了保证半导体封装质量的关键技术。详细阐述了引线键合中质量检测的技术方法,对比了各种技术的目的和技术特点,总结了各种方法的使用场合,并提出了键合线质量检测尚需解决的问题和发展方向。

Wire bonding technology is the most widely used method to make interconnections in integrated circuit（IC）. Quality evaluation plays an increasingly important role in wire bonding process to satisfy the need of reliability and low-cost. A brief introduction of failure mechanisms in wire bonding is provided. A review of detection and inspection methods to evaluate bonding quality is then carried out, The challenges and some new problems are also introduced.