基于X射线成像的BGA焊接质量检测技术

BGA Soldering Quality Detection Techniques by X Ray Imaging

针对BGA焊接质量检测难度大,缺乏检测标准的问题。分析了常见的BGA焊接缺陷;提出基于X射线二维成像和3D断层扫描技术来检测BGA焊接质量,设计了X射线检测BGA焊接质量的工艺流程;解析了每种焊接缺陷在X射线图像中的典型形貌,通过实验验证给出了合格判据的建议。

Aim at solving the problem that there are huge difficulties in BGA soldering quality examination and also a lack in relevant testing standard, common BGA soldering defects has been analyzed; a BGA soldering quality X-ray（2D imaging and 3D tomoscan） detecting approach has been proposed and the technological process has been described in detail. The typical X-ray imaging appearances of every soldering defect have been analyzed and appropriate qualified criterions have been proposed through experimental verification.