摘要
针对BGA焊接质量检测难度大,缺乏检测标准的问题。分析了常见的BGA焊接缺陷;提出基于X射线二维成像和3D断层扫描技术来检测BGA焊接质量,设计了X射线检测BGA焊接质量的工艺流程;解析了每种焊接缺陷在X射线图像中的典型形貌,通过实验验证给出了合格判据的建议。
Aim at solving the problem that there are huge difficulties in BGA soldering quality examination and also a lack in relevant testing standard, common BGA soldering defects has been analyzed; a BGA soldering quality X-ray(2D imaging and 3D tomoscan) detecting approach has been proposed and the technological process has been described in detail. The typical X-ray imaging appearances of every soldering defect have been analyzed and appropriate qualified criterions have been proposed through experimental verification.
出处
《电子工艺技术》
2016年第1期32-34,39,共4页
Electronics Process Technology
关键词
BGA
焊接质量
X射线检测
虚焊
枕头效应
BGA
soldering quality
x-ray inspection
rosin joint
head in pillow