金刚石飞切单晶硅的切削力模型及试验研究

Cutting Force Model and Experiments of Single Crystal Silicon under Diamond Fly-cutting

首先对金刚石飞切单晶硅的加工特点进行分析,建立了未变形切屑厚度模型及材料去除类型的理论判定条件;然后推导出了适合金刚石飞切加工特点和单晶硅材料特性的数学预测模型;最后进行了切削力正交试验,并通过切削力试验值与模型计算值对比验证了切削力模型的合理性。同时根据试验结果总结了各主要加工参数(切深ap、进给量f、主轴转速n)及其产生的最大未变形切屑厚度hmax对切削力的影响规律。

The processing characteristics of single crystal silicon under diamond fly-cutting were analyzed herein,and the mathematical model for the undeformed chip thickness and the theoretical de- terminant criteria which may distinguish the types of materials removal were built separately, then the mathematical prediction model of the cutting force was established, which befits both the traits of dia- mond fly-cutting technology and the material properties of single crystal silicon, finally the cutting forces were measured through the cutting orthogonal experiments of the silicon wafer under the dia- mond fly-cutting. As a result, the rationality of cutting force model was proved by comparing the cal- culated values and the experimental measured values of cutting force, meanwhile, the influence rules of the largest undeformed chip thickness hmax and the main working parameters on cutting forces were summarized based on the experimental results.