期刊文献+

N极性GaN/AlGaN异质结和场效应晶体管(英文)

N-Polar GaN/AlGaN Heterostructures and Field Effect Transistors
下载PDF
导出
摘要 由于晶格的反转和随之而来的极化场的反转,N极性面氮化物材料已经成为微波功率器件应用的理想材料之一。在2英寸(1英寸=2.54cm)偏角度4H-SiC衬底上通过金属有机物化学气相沉积(MOCVD)的方法生长了N极性面GaN/AlGaN异质结材料,使用X射线衍射仪(HR-XRD)、原子力显微镜(AFM)、Raman光谱仪和扫描电子显微镜(SEM)等对材料进行了表征。结果表明,N极性面GaN/AlGaN异质结材料的二维电子气面密度和迁移率分别为0.92×1013cm^(-2)和1035cm^2/(V·s)。制备了N极性GaN/AlGaN异质结场效应晶体管(HFET)。测试结果表明,1μm栅长的n极性面GaN/AlGa NHFET器件峰值跨导为88.9mS/mm,峰值电流为128mA/mm。 Due to the inverse of lattice structure and consequent inverse of polarization field, The N- polar III-Nitrides have been one of the most promising materials for microwave power devices. N-polar GaN/A1GaN heterostructures were grown on 2-inch ( 1 inch = 2.54 cm) vicinal 4H-SiC substrates by metal organic chemical vapor deposition (MOCVD). The crystalline information of the heterostructure material was determined by high-resolution X-ray diffraction (HR-XRD) , atom force microscopy (AFM) , Raman spectra and scanning electron microscopy (SEM). The results show that the N-polar GaN/A1GaN heterostructure material exhibits the two-dimensional electron gas sheet density of 0.92 × 10^13 cm^-2 and a mobility of 1 035 cm2/ (V · s), respectively. The N-polar GaN/A1GaN heterostructure field effect transistors (HFETs) were also fabricated. The test results show that the peak transconductance of N-polar GaN/A1GaN HFETs with the gate length of 1 μm is 88. 9 mS/mm, and the peak drain current is 128 mA/mm.
出处 《半导体技术》 CAS CSCD 北大核心 2016年第2期114-118,共5页 Semiconductor Technology
关键词 N极性 GaN/AlGaN 异质结场效应晶体管(HFET) 异质结 金属有机化学气相沉积(MOCVD) N-polar GaN/A1GaN heterostructure field effect transistor (HFET) heterostructure metal organic chemical vapor deposition (MOCVD)
  • 相关文献

参考文献15

  • 1NIDHI S,DASGUPTA D,BROWN F,et al.N-polar Ga N-based highly scaled self-aligned MIS-HEMTs with state-of-the-art fT·LG product of 16.8 GHz-μm[C]∥Proceedings of IEEE International IEDM.Baltimore,MD,USA,2009:1–3.
  • 2RAJAN S,CHINI A,WONG M H,et al.N-polar Ga N/Al Ga N/Ga N high electron mobility transistors[J].Journal of Applied Physics,2007,102(4):044501.
  • 3DENNINGHOFF D,LU J,LAURENT M,et al.N-polar Ga N/In Al N MIS-HEMT with 400 GHzmax[C]∥Proceedings of the 70thAnnual Device Research Conference(DRC).University Park,Pennsylvania,USA,2012:151-152.
  • 4KOLLURI S,KELLER S,DENBAARS S P,et al.Microwave power performance N-polar Ga N MISHEMTs grown by MOCVD on Si C substrates using an etch-stop technology[J].IEEE Electron Device Letters,2012,33(1):44-46.
  • 5KELLER S,FICHTENBAUM N A,WU F,et al.Influence of the substrate misorientation on the properties of N-polar Ga N films grown by metal organic chemical vapor deposition[J].Journal of Applied Physics,2007,102(8):083546.
  • 6WONG M H,KELLER S,NIDHI S D,et al.N-polar Ga N epitaxy and high electron mobility transistors[J].Semiconductor Science and Technology,2013,28(7):074009.
  • 7KELLER S,SUH C S,CHEN Z,et al.Properties of N-polar Al Ga N/Ga N heterostructures and field effect transistors grown by metalorganic chemical vapor deposition[J].Journal of Applied Physics,2008,103(3):33708-33708.
  • 8ZYWIETZ T K,NEUGEBAUER J,SCHEFFLER M.The adsorption of oxygen at Ga N surfaces[J].Applied physics letters,1999,74(12):1695-1697.
  • 9WON D,WENG X,REDWING J M.Metalorganic chemical vapor deposition of N-polar Ga N films on vicinal Si C substrates using indium surfactants[J].Applied Physics Letters,2012,100(2):021913-1-021913-5.
  • 10LUNDSKOG A,KAKANAKOVA A.Improved hot-wall MOCVD growth of highly uniform Al Ga N/Ga N/HEMT structures[J].Journal of Crystal Growth,2009,311(10):3007-3010.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部