直流反应磁控溅射沉积a-C:H薄膜的微结构和摩擦磨损行为

Microstructures and tribological properties of a-C:H film prepared by DC reactive magnetron sputtering

采用直流的反应磁控溅射技术,以高纯石墨为溅射靶材和CH_4为反应气体,调节CH_4流量,在p(100)单晶硅和不锈钢基底上成功制备出系列的含氢a-C:H薄膜.利用场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)、Raman光谱、纳米压痕仪、CSM划痕测试仪、摩擦磨损试验机等测试手段对所制备含氢a-C:H薄膜的微结构、力学性能和摩擦磨损行为进行系统表征.结果表明:随着CH_4流量的增加,含氢a-C:H薄膜的致密度呈现出微弱的先增加后减小的趋势;薄膜的沉积速率随着CH_4流量的增加逐渐增加,但增幅呈现出逐渐减小趋势;随着CH_4流量的增加,薄膜中sp^3杂化键含量及其纳米硬度和杨氏模量也呈现出先增加后减小的规律;摩擦实验结果表明当CH_4流量为8 sccm,所制备的含氢a-C:H薄膜的摩擦学性能最佳,摩擦系数为0.20,磨损率为6.48×10^(-7)mm^3/(N·m).

A series of a-C：H films were deposited on silicon p（100） wafer and stainless steel substrates by DC reactive magnetron sputtering using graphite targets in an argon and methane atmosphere with different methane flow rates. Microstructures, mechanical and tribological properties were characterized systemically hy FESEM, AFM, Raman spectroscopy, nano-indentation, CSM scratch tester and tribo-tester. The results show that there is a light tendency of density of the a-C：H film with initial increase and then decrease with the increase of methane flow rate. The deposition rate of a-C：H film presents an increase with the increase of methane flow rate while the increase range is gradually reduced. Besides, the sp3 bond content, the nano-hardness and Young＇s modulus increase at the initial stage and then decrease with the increase of methane flow. Frictional and wear behaviors show that the a-C：H film deposited at the methane flow rate of 8 sccm is achieved low friction coefficient with 0.20 and high anti-wear with 6.48×10^-7mm^3（N·m）.