工艺参数对图案化金属铜膜结构和光学性能的影响

Influence of Processing Parameters on the Crystal Structure and Optical Absorption of Copper Wire-Patterned Films

为了系统研究工艺参数对图案化金属铜膜的影响，进一步优化产物的结构和光学性能，研究通过改变薄膜厚度、衬底偏压和衬底温度等工艺参数在玻璃衬底上沉积了图案化金属铜膜。利用粉末x射线衍射仪和紫外可见分光光度计分别研究了工艺参数对图案化金属铜膜的晶体结构和光学吸收特性的影响。研究结果表明，在晶体结构方面，图案化金属铜膜具有良好的Cu（111）择优取向，并且衍射峰强度随薄膜厚度、衬底温度的增加而增强，随衬底偏压的增加而减弱。在光学性质方面，图案化金属铜膜在630-660nm红光波段出现反常光学吸收。而且，吸收峰的强度、峰位和半高宽可以通过调节薄膜厚度、衬底偏压和衬底温度加以控制。

To systemically investigate the influence of processing parameters and further optimize the per- formance of products, various copper wire-patterned films were deposited on glass substrates via changing the film thickness, substrate bias voltage and temperature. The achieved copper wire-patterned films were characterized by a powder X-ray diffractometer and a UV/VIS spectrometer to study the influence of pro- cessing parameters on the crystal structure and optical absorption respectively. The results showed that the samples were of a preferential orientation of Cu（111）, whose intensity increased with the increasing of film thickness and substrate temperature while decreased with the increasing of substrate bias voltage. The samples also exhibited an abnormal optical absorption at the red-light range of about 630-660nm, which was found to be adjustable by changing the film thickness, substrate bias and substrate temperature.