摘要
针对TO型针封结构陶瓷外壳在封接过程中的开裂、变形等失效现象,采用ABAQUS有限元模拟软件,系统分析了包铜复合引线、氧化铝陶瓷环、柯伐过渡片及钢框架的应力分布规律。结果表明残余应力在陶瓷环上存在集中情况,且陶瓷内环受拉应力,极易导致瓷件微裂纹和开裂。进而解释了针封结构外壳在钎焊封接时易出现严重的因瓷件微裂纹或开裂引起的可靠性失效现象,并对类似针封结构外壳封接的可靠性评估和优化设计有一定的指导意义。
A 3D calculating model, according to pin sealing structure, was proposed to analysize the influence of residual stress to the faults in reliability of TO ceramicpackage by using ABAQUS finite element program. Through analysis in distribution of residual stress among Kovarpin ofcopper core, ceramic ring, Kovarsheet and steelframe, the result show that the residual stress of soldering had stress concentration, which concentrated on the ceramic ring. And this stress concentration easily led the crack in ceramic. The paper gave the explanation of the fault which was because of the crack in ceramic ring after soldering. And some advisements were proposed to improve the design of similar structure to avoidfaults in reliability.
出处
《电子与封装》
2016年第2期9-13,共5页
Electronics & Packaging
关键词
针封结构
外壳
应力
有限元
pin sealing
package
stress
finite element method
