摘要
某模块产品在交付用户试验时多次出现Flash芯片脱焊现象,本文分析了原因并进行试验验证。
When the module products were delivered to users, the Flash chip desoldering appeared repeatedly while experiment, this paper analysis reason of desoldering, and the correctness is verified by experiment.
出处
《科技风》
2016年第4期92-93,共2页
