微细导线激光可控剥离的工艺优化研究

Process Parameters Research of Strippingthe Thin Wire in a Controlled Manner by Laser

对于导线的激光剥离,一般采用CO_2激光器剥除绝缘外皮,用YAG激光器剥除金属屏蔽层。为了降低成本及减少工序,尝试用功率为20 W的YAG激光器对微细导线的绝缘外皮和金属屏蔽层进行一体剥离,并对其进行了激光剥线的理论分析,然后着重分析了激光参数对剥线质量的影响。主要采用了正交试验法,确定了平均功率、扫描速度、频率、脉宽这四个因素对剥线质量的影响权重及影响规律,从而在适当的范围内通过增大平均功率和减小频率等可以最大限度地提高剥线的质量,即使切口既深又窄。

In general,stripping wire using two kinds of laser.For example,stripping insulation sheath by CO_2 laser and stripping metal shielding layer.In order to reduce costs and process,in the paper,YAG laser which has 20 Woutput power is used to evaluate the insulation of the fine wire skin and metal shielding layer which diameter is 1.1mm for an organic whole.The paper analyzes the theory of stripping thin wire by laser.Research has been done of mobile phone antenna stripping,and the influence of different process parameters on the stripping quality has been analyzed.So in the paper,using the orthogonal experiment method,that the average power,scanning speed,frequency,pulse width of the four factors on the quality of the wire stripping weight and influence law has been obtained.Then in appropriate range by increasing the average power and decreasing the frequency can maximally improve the stripping,making the incision deep and narrow.