酸性体系对镁铝尖晶石工件固结磨料研磨的影响

Effect of Acidic Slurries on Lapping Spinel Wafer with Fixed Abrasive Pad

研磨介质的化学作用对于固结磨料研磨的材料去除率和表面质量具有至关重要的影响。采用不同的酸性介质对镁铝尖晶石样品进行研磨,研究了其对镁铝尖晶石固结磨料研磨的材料去除率和表面质量的影响;采用电感耦合等离子质谱仪(ICP)测量了不同酸性介质对镁铝尖晶石工件和研磨垫的化学腐蚀作用,并进一步采用电化学工作站检验了不同酸性介质对研磨垫填料铜的腐蚀性能。结果表明:研磨介质对填料铜的化学腐蚀促进研磨垫的自修整是其对研磨过程材料去除率产生影响的主要因素,其中3%乙酸研磨后的材料去除率最大,可达249.97 nm/min;研磨介质对工件的化学作用可以改善工件的表面质量,其中3%磷酸研磨后的工件表面粗糙度值最小,仅为72.4 nm。

The chemical effect of lapping slurry is very important for material removal rate and surface quality during lapping with fixed abrasive pad. Acidic slurries were used for spinel wafers lapping with fixed abrasive pad（ FAP）,and the effects of acidic slurries on material removal rate and surface quality were revealed. The inductively coupled plasma source mass spectrometer（ ICP） was employed to detect the chemical corrosion effects of different acidic slurries on spinel samples and FAP, and the electrochemical workstation was also employed to examine corrosion behaviors of acidic slurries to filling copper. The results show that promotions of acidic slurries chemical corrosion to filling copper for FAP self-condition is the key factor to enhance the material removal rate of lapping. In which,the material removal rate with 3% acetic acid for lapping is the biggest,it is 249. 97 nm / min. The slurries chemical effect on spinel wafers could improve the surface quality. In which,the roughness value lapping with 3%phosphoric acid is the smallest,which is only Ra 72. 4 nm.