摘要
Stretchable electronics, which offers the performance of conventional wafer-based devices and mechan- ical properties of a rubber band, enables many novel applications that are not possible through conven- tional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate. Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1-2℃ temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations.
Stretchable electronics, which offers the performance of conventional wafer-based devices and mechan- ical properties of a rubber band, enables many novel applications that are not possible through conven- tional electronics due to its brittle nature. One effective strategy to realize stretchable electronics is to design the inorganic semiconductor material in a stretchable format on a compliant elastomeric substrate. Engineering thermal management is essential for the development of stretchable electronics to avoid adverse thermal effects on its performance as well as in applications involving human body and biological tissues where even 1-2℃ temperature increase is not allowed. This article reviews the recent advances in thermal management of stretchable inorganic electronics with focuses on the thermal models and their comparisons to experiments and finite element simulations.
基金
supported by the Zhejiang Provincial Natural Science Foundation of China(Grant No.LR15A020001)
the National Natural Science Foundation of China(Grant Nos.11502009,11372272 and 11321202)
the National Basic Research Program of China(Grant No.2015CB351900)
