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LED光源节能认证技术规范解读

Technical Specification of LED Light Source Energy-Saving Certification
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摘要 对中国质量认证中心开展的LED光源产品节能认证技术规范中的要求进行解读。从光、电、色等几个方面为广大企业和消费者了解节能产品的具体参数要求提供参考。 The technical specifications of LED light source energy-saving certification are studied,which are developed by China Quality Certification Center.From several aspects such as color,light and electric,this paper provides references for the majority of enterprises and consumers to understand the specific parameters requirement of energy-saving products.
出处 《中国照明电器》 2016年第2期30-33,共4页 China Light & Lighting
关键词 LED光源 节能认证 技术规范 LED light source energy-saving certification technical specification light electric color
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  • 1Craford M G. LEDs for solid state lighting and other emerging applications: status, trends, and challenges[C]// Ferguson L T, Carrano J C, Taguchi T, et al. 5th International Conference on Solid State Lighting. Bellingham: SPIE, 2005, 5941: 101-110.
  • 2Liu Z Y, Liu S, Wang K, et al. Status and prospects for phosphor-based white LED packaging[J]. Frontiers of OptoelectronicsinChina, 2009, 2 (2) 119-140.
  • 3You J P, He Y, Shi F G. Thermal management of high power LEDs: impact of die attach materials[C]// Microsystems, Packaging, Assembly and Circuits Technology. Taipei. IEEE, 2007: 239-242.
  • 4Kumar R N, Keem L Y, Mang N C, et al. Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes[J]. Journal of Applied Polymer Science, 2006, 100 (2) 1048-1056.
  • 5Morita Y. Cationic polymerization of hydrogenated bisphenol- glycidyl ether with cycloaliphatic epoxy resin and its thermal discoloration[J]. Journal of Applied Polymer Science, 2005, 97 (3) : 1395-1400.
  • 6LinYC, TranN, ZhouY, et al and solutions for the packaging of 2006 International Conference. Taiwan Microsystems, IEEE, 2006. Materials challenges high power LEDs[C]// Packaging, Assembly 1-4.
  • 7中国LED网.固晶银胶发黑[EB/OL].(2013-10-21)http://www.cnledw.com/inter/show-3.157352.htm.
  • 8Schubert E F. Light-emitting Diodes[M]. New York: Cambridge University, 2006: 351-353.
  • 9郭康,梁超.暖白光LED光源色飘移机理分析[EB/OL].(2014-01-16、http://www.cnledw.com/tech/detail-37971.htm.
  • 10Bahadur M, Norris A W, Zarisfi A, et al. Silicone materials for LED packaging[C]//Ferguson L T, Carrano J C, Taguchi T, et al. 6th International Conference on Solid State Lighting , SPIE, 2006, 6337: 1-10.

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