点涂焊膏的制备工艺及性能研究

Preparation and properties of dispensing solder paste

使用了润湿力测试和黏度测试的方法来探究点涂焊膏的制备工艺并最终获得性能优异的产品。配合点胶机与空气压缩机的使用,探讨了点涂过程中点涂滞留时间、黏度和点涂压力对点涂量的影响。结果表明:对于黏度、针头内径、点涂滞留时间均固定的点涂焊膏,点涂量随压力的增大而增大,并呈现出拟合程度很好的线性关系。

The investigation used the methods of wetting force test and viscosity test in order to explore the preparation of dispensing solder paste and obtained products with excellent performance eventually. Cooperating with the dispenser and air compressor, the influence of delay time, viscosity and pressure on the process of dispensing was studied. The results show that on the condition that the value of viscosity, the size of needle inner diameter and the delay time of dispensing solder paste are constants, a high pressure tends to increase the mass of dispensing. Moreover, it has a linear fitting relationship between the dispensing mass and the pressure.