摘要
分析了高密度、细间距板间电连接器的结构特点和装联技术难点,采用设计搪锡工装、改进电连接器的安装方式及工艺方法,解决了高密度、细间距板间电连接器的搪锡、插装及焊接等工艺瓶颈问题,总结出航天遥感器用高密度、细间距板间电连接器的装联工艺方法。
This paper analyzes the structural characteristics and the assembly difficulties of the high-density board to board interconnector. Designing tin tools, improving the installation way and preheating PCB are used to solve the lining tin, installation and welding problems. The assembly process methods of the high-density board to board interconnector are summarized for space optical remote sensor.
出处
《航天制造技术》
2016年第1期46-48,共3页
Aerospace Manufacturing Technology
关键词
板间对插
搪锡
插装
电连接器
装联
board to board
tin pin
mounting
interconnector
assembly
