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Ku波段的新型分形小型化天线 被引量:4

Novel fractal miniaturized antenna in Ku band
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摘要 天线的小型化对于微波封装系统集成度的提高,性能的改善,成本的降低有着重要作用。将分形结构引入传统折叠槽天线,通过加载自相似的分形结构使天线的面积缩小,进一步利用高阻衬底取代了背部镂空结构使得天线面积缩小为原先镂空衬底下的22%,不仅提高了天线的性能,而且增强了结构可靠性。天线工作在Ku波段,使用ANSYS HFSS进行建模和仿真。最后通过MEMS加工平台做出了二阶分形结构的样品,给出了详细的工艺流程,并就关键步骤进行介绍,最后给出了仿真结果与测试结果的对比。 Miniaturization of antenna play an important role in increasing integration of microwave packaging system performance improving, and reducing cost. A novel miniaturized antenna is designed introducing fractal structure into general slot folded antenna, the goal of miniaturization is achieved by loading self-similar fractal structure, furthermore, a kind of high resistance structure processed by etching and oxidation is chosen as substrate, which is better than the substrate with back-etching cavity. The area of antenna based on the high resistance substrate is only 22 % of that based on substrate with back-etching cavity. The antenna works in Ku band. Modeling and simulation is carried out by ANSYS HFSS. Second-order fractal structure specimen is manufactured on the MEMS processing platform, and process is given, and is key step introduced, comparison of simulation result and test result are given.
出处 《传感器与微系统》 CSCD 2016年第3期25-29,共5页 Transducer and Microsystem Technologies
基金 上海市自然科学基金资助项目(13ZR1447300)
关键词 天线 分形 高频结构仿真器 工艺 antenna fractal high frequency structure simulator(HFSS) process
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参考文献8

  • 1Fan J A,Yeo W H,Su Y W,et al.Fractal design concepts for stretchable electronics[J].Nature Communications,2014,5(2):3266-3271.
  • 2Puente C,Romeu J,Pous R,et al.Small but long Koch fractal monopole[J].Electronics Letters,1998,34(1):9-10.
  • 3Kim D H,Xiao J L,Song J Z,et al.Stret-chable,curvilinear electronics based on inorganic materials[J].Advanced Materials,2010,22(19):2108-2124.
  • 4Barliarda C P,Romeu J,Cardama A.The koch monopole:A small fractal antenna[J].IEEE Transactions on Antennas and Propagation,2000,48(11):1774-1779.
  • 5Mandelbrot B B.The fractal geometry of nature[M].New York:Freeman W H,1983:2-12.
  • 6Song S S,Kim Y M,Maeng J M,et al.A millimeter-wave systemon-package technology using a thin-film substrate with a flip-chip interconnection[J].IEEE Transactions on Advanced Packaging,2009,32(1):101-108.
  • 7Pieters P,Vaesen K,Brebels S,et al.Accurate modeling of highQ spiral inductors in thin-film multilayer technology for wireless telecommunication applications[J].IEEE Transactions on Microwave Theory and Techniques,2001,49(4):589-599.
  • 8Carchon G,Vaesen K,Brebels S,et al.Multilayer thin-film MCMD for the integration of high-performance RF and microwave Circuits[J].IEEE Transactions on Components&Packaging Technologies,2001(24):510-519.

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