摘要
文章从PCB孔金属化的基本原理出发,利用正交实验法分析了孔壁凹坑问题形成的原因,探讨了预防孔壁凹坑的有效措施,并通过小批量生产验证了改善措施的可行性。
On the principle of hole metallization of PCB, the causes of hole wall pits in hole metallization were analyzed by means of the ortho-experiment in this paper. The corresponding preventive measures were then discussed and confirmed by a test of small bach of production.
出处
《印制电路信息》
2016年第3期20-23,共4页
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